Rosfix Flux In Syringe Nc-559-Asm + Soldering Paste (Liquid Tin) Xgsp50 42G 183

Rosfix Flux in Syringe NC-559-ASM + Solder Paste (liquid tin) XGSP50 42g 183℃ This kit is particularly useful for surface mount technology (SMT) repair and assembly or small soldering projects where precision and cleanliness are key. The combination of no-clean flux and solder paste makes it versatile and suitable for a variety of soldering tasks in electronics. The kit includes: Rosfix Flux NC-559-ASM in Syringe : This is a type of flux used during soldering. Flux is a chemical cleaning agent that facilitates the soldering process by removing oxides from metal surfaces, allowing for better solder adhesion. NC-559-ASM is a popular no-clean type of flux, meaning it doesn't need to be cleaned after soldering, which is very convenient during electronic repairs. Solder Paste (Liquid Tin) XGSP50 42g : This is a type of solder paste that combines solder powder with flux. The paste is applied to the area to be soldered and then heated, causing the tin to melt and bond to the metal surfaces. "183℃" refers to the melting point of this solder paste, which is suitable for many standard soldering applications. NC-559-ASM 10cc Flux Syringe No-clean type : NC-559-ASM is a no-clean type, which means it does not require particularly thorough cleaning after the soldering process. Gel consistency: The flux has a gel consistency, which makes it easy to apply, and its thick form facilitates precise application. Easy cleaning: Flux residues can be easily removed with cleaning fluids such as isopropanol. Ideal for reballing and soldering BGA and SMD components: Thanks to the appropriate viscosity, this flux is ideal for advanced soldering techniques such as reballing, as well as for soldering BGA and SMD components. Easy spreading: This flux spreads easily, which facilitates the soldering process and ensures even surface coverage. High Intensity: It has high intensity, which means it is effective in wetting the solder surface, which is crucial for successful soldering. High Intensity and Wettability : NC-559-ASM stands out for its high intensity and wettability of the solder surface. This guarantees precise and durable connections during the soldering process. Applications in Repair and Manufacturing: This flux is indispensable when repairing damaged electronic components, such as solder balls or BGA chips in cell phones. Its properties do not impair the function of ICs and PCBs, ensuring safe and professional results. Electronic Component Protection: A key advantage of this flux is that it does not degrade the properties of electronic components such as ICs or PCBs. This means that the connections are not only durable, Preventing Melted Solder from Sticking: This flux is designed to prevent molten solder from sticking. This allows you to maintain clarity and accuracy in your work, even during the most difficult tasks. Rosfix Solder Paste (liquid tin) XGSP50 42g 183℃ No Clean: No need for washing after soldering, increases process efficiency. Silver Formula: New formula with silver for excellent soldering efficiency. Use in GSM and BGAP stencils: Ideal for GSM and BGAP stencils technology, ensures the desired representation of solder pads on BGA systems. Pre-Coating of BGA Pads with Lead Tin: Perfect for pre-soldering BGA pads with lead tin. Easy Application and Activation: Easy application, activated by heating to 183°C. No Washing Required after Soldering/Reflow: No washing required after the finished process. Storage at 0°C - 10°C: Retention of properties when stored at appropriate temperature. Resin and Solvent Based Flux: Contains resin and solvent-based flux for effective soldering. ‼ Our offer also includes spatulas for spreading the paste. ‼ Specification: Melting point: 183°C Weight: 42g Alloy: Sn63 / Pb37 Particle size: 25-38 µm Viscosity: 50 (Pa S)